Kev paub

Kev piav qhia ntxaws txog cov txheej txheem txheej txheem ntawm txhua tus txheej txheem ntawm TOPCON

 Kev ntxhib los mos

Tshooj ntawv (tag nrho ntawm 6 kab) suav nrog kev ntxuav ua ntej - ntxuav dej ntshiab ua ntej texturing - texturing * 3 - dej ntshiab ntxuav tom qab texturing - tom qab ntxuav dej ntshiab ntxuav - pickling - dej ntshiab ntxuav tom qab pickling - qeeb lifting pre- lub cev qhuav dej - ziab * 5 thiab lwm yam modules. Cov txheej txheem texturing ntawm qhov project no txhua tus txais yuav tsis siv neeg texturing, tag nrho cov txheej txheem ua haujlwm yog ua tiav, lub caj npab conveyor yuav raug xa mus rau qhov chaw pub mis ntawm lub tshuab texturing tom qab ntxuav ua ntej, silicon wafer hauv lub tshuab kaw tsis siv neeg texturing los ntawm Cov menyuam los ntawm txhua qhov corrosion, tu lub tank, cov cuab yeej tsis siv neeg tswj kom ntxiv cov kua qaub, lye thiab cov dej ntshiab hauv txhua qhov module, cov kua qaub thiab lye hauv lub tank tau tso rau hauv cov raj xa dej, thiab tsis tu ncua (ib lub tank ntim ntawm 720L, 48h mus rau hloov ib zaug) tso cov dej khib nyiab hauv lub tank.

 1) Kev ntxuav ua ntej

Lub hom phiaj ua ntej ntxuav: Tshem tawm cov impurities (organic teeb meem, hlau impurities, thiab lwm yam) adhered rau saum npoo ntawm silicon wafer, siv NaOH tov thiab H2O2 tov.

Lub loaded silicon wafers yog muab tso rau hauv lub tank ua ntej ntxuav, dej ntshiab yog ntxiv rau lub tank, thiab ib qho tsim nyog ntawm NaOH tov los yog tshuaj ntxuav yog ntxiv raws li qhov sib piv (NaOH concentration yuav tsum yog 0.6% tom qab sib tov. , H2O2 concentration yuav tsum yog 1.5%, tsis siv neeg ntxiv) rau kev ntxuav kub kub (60 ° C). Kev ntxuav ua ntej siv ultrasonic tu. Cov dej ntshiab huv tom qab ntxuav ua ntej. Kev ntxuav dej ntshiab yog tag nrho cov dej ntws tawm hauv kev ntxuav, txhua yam ua tiav ntawm chav tsev kub.

 Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm ua ntej ntxuav yog raws li nram no:

Si+2NaOH+H2O=Na2SiO3+2H2↑

 2) Alkali kev ntxhib los mos

Lub Hom Phiaj: Txhawm rau nqa tawm anisotropic corrosion ntawm crystal ntawm silicon nto los ntawm lye los tsim ib lub pyramid nrog qhov loj ntawm 5um, thiab cov pyramid suede nto muaj lub teeb zoo heev thiab cov nyhuv anti-reflection (10%). Alkali texturing siv NaOH tov thiab texturing additives.

Ntxiv qhov tsim nyog ntawm NaOH tov thiab texturing additives (NaOH tov concentration ntawm li 0.6%, texturing additive concentration ntawm li 0.4%) rau lub alkali pawg tank, uas yuav txo tau cov nto nro ntawm silicon wafers, txhim kho cov wetting nyhuv ntawm silicon wafers. thiab NaOH kua, thiab txhawb kev tso tawm ntawm hydrogen npuas, txhim khu lub anisotropy ntawm corrosion, ua rau lub pyramid zoo ib yam thiab zoo ib yam, thiab txhim kho cov nyhuv ntawm suede nto. Cov tshuaj tiv thaiv txheej txheem ntawm kev tsim cov suede yog raws li nram no:

Si+2NaOH+H2O=Na2SiO3+2H2↑

Kev ua haujlwm kub ntawm alkali texturing tank yog 82 ° C, thiab lub sijhawm tswj ntawm alkali texturing yog 420s.

 3) Ntxuav tom qab

Lub silicon wafer tom qab alkali texturing nkag mus rau tom qab ntxuav lub tank kom tshem tawm cov khoom seem ntawm cov organic thiab ua kom huv si ntawm silicon wafer nto, yog li txhim kho cov roj teeb hloov pauv mus rau qee yam. Tom qab immersion nyob rau hauv lub loaded silicon wafer, ntxuav nws, ntxiv dej ntshiab rau lub tank, thiab ntxiv ib tug tsim nyog tus nqi ntawm NaOH tov los yog ntxuav kua (NaOH concentration yuav tsum yog 0.6%, H2O2 concentration yuav tsum yog 1.5%) raws li qhov sib piv rau kev kub kub tu (60 ° C). Tom qab ntxuav, dej huv yog nqa tawm. Kev ntxuav dej ntshiab yog tag nrho cov dej ntws tawm hauv kev ntxuav, nqa tawm ntawm chav tsev kub.

 4) Pickling

Tom qab ntxuav, dilute acid tov (3.15% HCl thiab 7.1% HF) yog xav tau rau high-purity tu, lub luag hauj lwm ntawm HCl yog neutralize lub residual NaOH, lub luag hauj lwm ntawm HF yog tshem tawm cov oxide txheej nyob rau saum npoo ntawm cov khoom. silicon wafer ua rau saum npoo ntawm silicon wafer ntau hydrophobic, tsim ib txoj hauv kev ntawm silicon H2SiF6, los ntawm kev sib xyaw nrog cov hlau ions cais cov hlau ions los ntawm qhov chaw ntawm silicon wafer, kom cov hlau ion ntsiab lus ntawm silicon wafer yog txo, nyob rau hauv kev npaj rau diffusion thiab junction. Cov dej huv huv yog nqa tawm tom qab pickling.

 Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm pickling yog raws li nram no:

HCl + NaOH = NaCl + H2O

SiO2+6HF=H2SiF6+2H2O

 Kev ua haujlwm kub ntawm lub tank pickling yog qhov kub thiab txias, thiab lub sijhawm tswj lub sijhawm yog 120s.

 5) Slow lifting ua ntej lub cev qhuav dej

Lub Hom Phiaj: Ua ntej dewatering saum npoo ntawm crystalline silicon wafers, feem ntau yog cov kauj ruam kawg hauv cov txheej txheem ntxuav dej ntshiab.

Lub crystalline silicon wafer ntxuav los ntawm cov dej ntshiab yog pauv mus rau qhov qeeb rub zawj, thiab cov silicon wafer yog thawj zaug rau hauv cov dej ntshiab kom nkag mus rau hauv tag nrho, thiab tom qab ntawd maj mam nqa mus rau pem hauv ntej los ntawm kev tswj thiab dai pob tawb, thiab qhov nro tuaj yeem rub tawm. dej zaj duab xis ntawm silicon wafer.

Lub qeeb rub zawj yog tsim los ntawm kev tu lub tank thiab lub tshuab rub qeeb, uas yog ib nrab kaw. Muaj ib qho serrated overflow chaw nres nkoj nyob rau hauv lub tank tu, thiab cov dej huv tsis tu ncua ntxuav cov dej phwj tuaj ntawm lub tank tu thaum ua hauj lwm, ua kom cov dej zoo ntawm lub tank ntxuav kom huv si, thiaj li ua tiav cov nyhuv tu; Thaum cov dej huv huv, tsis muaj cov tee dej yuav tshwm rau ntawm qhov chaw ua haujlwm hauv qab qhov kev txiav txim siab ntawm kev rub qeeb, thiab yuav tsis muaj cov cim dej thaum ziab.

 6) Ua kom qhuav

Lub crystalline silicon wafer raug xa mus rau lub tank kom qhuav, thiab cua kub ntawm 90 ° C yog tshuab los ntawm silicon wafer kom qhuav, thiab ziab yog hluav taws xob cua sov.

Nyob rau hauv cov txheej txheem saum toj no, cov txheej txheem ua ntej ntxuav thiab alkali texturing yuav tsim high-concentration alkaline khib nyiab uas muaj sodium hydroxide (W1, W3, W5) thiab dav alkaline tu dej khib nyiab (W2, W4, W6), thiab cov txheej txheem pickling yuav tsim. high-concentration acidic wastewater (W7) muaj hydrochloric acid thiab hydrofluoric acid thiab cov kua qaub ntxuav cov dej khib nyiab (W8, W9). Kev ua haujlwm saum toj no yog nqa tawm nyob rau hauv lub tshuab kaw ntawv, thiab cov txheej txheem pipular yuav tau sau los ntawm cov raj dej khib nyiab thiab xa mus rau cov kua khib nyiab rau kev kho.

 Boron diffusion

Lub hom phiaj ntawm cov txheej txheem diffusion yog tsim PN kev sib tshuam ntawm silicon wafer kom paub txog kev hloov pauv ntawm lub teeb lub zog rau hauv hluav taws xob. PN hlws ris manufacturing khoom yog ib tug diffusion rauv, qhov project siv gaseous boron trichloride diffuse silicon wafer nyob rau hauv lub qhov cub diffusion, thiab boron atoms nkag mus rau silicon wafer los ntawm diffusion, thiab nyob rau tib lub sij hawm tsim ib txheej ntawm borosilicate iav rau saum npoo. ntawm silicon wafer. Lub ntsiab lus sib npaug yog:

4BCl3+3O2→2B2O3+6Cl2↑

2B2O3+3Si→3SiO2+4B

Lub tshuab hluav taws xob diffusion yog cov cuab yeej kaw tsis zoo, nruab nrog cua nkag thiab qhov hluav taws xob, siv hluav taws xob cua sov, thiab cov khoom siv los nrog lub tshuab nqus tsev tsis muaj roj qhuav. Cov txheej txheem tshwj xeeb yog: ua ntej dhau qhov ntws loj ntawm N2 kom tshem tawm cov huab cua hauv qhov cub tawg quartz raj, thiab ua kom sov lub qhov cub tawg, tos kom lub qhov cub kub nce mus txog 1050 ° C thiab tas li, muab cov wafer rau hauv quartz nkoj, xa mus rau lub qhov cub qhov cub rau preheating rau 20 feeb, thiab ces thawb mus rau hauv lub qhov kub thiab txias cheeb tsam, thawj zaug qhia oxygen, thiab ces qhia boron trichloride rau diffusion, tag nrho cov txheej txheem lub sij hawm yog 180 feeb. Thaum lub sij hawm cov tshuaj tiv thaiv, ob qho tib si Si thiab O2 ntau dhau, BCl3 tau tag nrho cov tshuaj tiv thaiv, thiab C12 tau tsim nyob rau hauv cov tshuaj tiv thaiv. Tom qab cov tshuaj tiv thaiv tiav, cov khoom siv N2 tshem tawm yog siv thiab cov khoom siv tau txiav tawm.

Kev soj ntsuam ntawm kev ua qias tuaj txuas: Lub ntsiab ntawm cov pa phem txuas ntawm cov txheej txheem no yog qhov sib txuas txuas tom qab cov tshuaj tiv thaiv los tsim cov tshuaj chlorine (G2) tov nrog cov pa seem seem, nitrogen, thiab lwm yam, uas yog sau los ntawm ib lub raj tshwj xeeb, xa mus rau cov kua qaub pov tseg. scrubber rau kev kho mob, sau los ntawm cov raj xa dej thiab xa mus rau cov kua qaub pov tseg roj scrubber rau kev kho mob.

 SAIB laser redoping

Laser doping tshuab yog ib qho hnyav doping ntawm lub rooj vag hlau (electrode) nyob rau hauv kev sib cuag nrog silicon wafer, thaum lub teeb doping (tsawg concentration doping) yog khaws cia sab nraum lub electrode. Los ntawm thermal diffusion, pre-diffusion yog nqa tawm ntawm qhov chaw ntawm silicon wafer los tsim lub teeb doping; Nyob rau tib lub sijhawm, qhov saum npoo BSG (borosilicate iav) yog siv los ua lub hauv paus laser redoping qhov chaw, thiab los ntawm lub zos thermal nyhuv ntawm lub laser, lub atoms nyob rau hauv BSG sai diffuse mus rau hauv silicon wafer zaum ob, tsim ib lub zos redoping. cheeb tsam.

Cov txheej txheem SE laser tsim cov plua plav tso pa tawm (G3), uas tau kho los ntawm lub tshuab tus kheej cov plua plav collector thiab tso tawm los ntawm lub ru tsev tso qhov system ntawm lub rhiav (qhov siab kwv yees li 15 meters).

 Tom qab oxidation

Qhov chaw saum npoo ntawm silicon wafer tau kho los ntawm laser SE, oxide txheej ntawm boron diffusion nto (mus rau hauv glossy nto) puas los ntawm qhov chaw lub zog ntawm lub laser. Thaum alkali polishing etching, ib txheej oxide yuav tsum tau ua lub npog ntsej muag los tiv thaiv phosphorus diffusion nto (rau hauv lub ntsej muag glossy) ntawm silicon wafer. Yog li ntawd, oxide kho ntawm qhov chaw scanned los ntawm laser SE yog yuav tsum tau.

Hauv qhov project no, SiO2 oxide txheej tau npaj los ntawm thermal oxygen oxidation. Tag nrho cov txheej txheem oxidation yog nqa tawm nyob rau hauv lub qhov cub oxidation, uas yog ib tug kaw atmospheric siab cov cuab yeej thiab yog rhuab los ntawm hluav taws xob. Ua ntej, cov ntawv tsis siv neeg loader yog siv los thauj cov silicon wafer mus rau lub nkoj quartz, thiab tom qab ntawd lub tshuab tsis siv neeg muab lub nkoj quartz rau ntawm silicon carbide cantilever slurry ntawm lub qhov cub oxidation, thiab silicon carbide paste xa lub nkoj quartz loaded nrog silicon. wafers rau hauv high-temperature quartz rauv tube. Tom qab lub nkoj quartz nkag mus rau hauv lub cub tawg, lub qhov cub lub qhov rooj kaw, qhov kev pab cuam oxidation pib, thiab lub qhov cub oxidation khiav tau. Cov tshuaj tiv thaiv tseem ceeb uas tshwm sim thaum thermal oxidation yog:

Si + O2 = SiO2

O2 reacts nrog rau saum npoo ntawm silicon wafer ntawm qhov kub thiab txias los ua SiO2, thiab qee qhov nyiaj ntawm nitrogen tau qhia los tswj lub siab tsis tu ncua hauv lub tshuab hluav taws xob. Tuav lub sijhawm kub ntawm cov pa oxygenation, kom muaj qee qhov tuab ntawm SiO2 nyias txheej yog tsim rau ntawm qhov chaw ntawm silicon wafer, thiab cov txheej txheem tsis yog: oxidation kub 750 ° C, nitrogen txaus tus nqi 12L / min, oxygen txaus tus nqi 5L / min, 25min oxidation lub sij hawm. Cov txheej txheem no ua rau cov pa oxidized tso pa (cov cua kub) uas muaj cov pa oxygen thiab nitrogen, uas tau tawm los ntawm qhov chaw nres nkoj ntawm lub qhov cub oxidation thiab tom qab ntawd tawm los ntawm lub ru tsev cua sov qhov system ntawm lub rhiav.

 Etching

 1) Mus rau BSG

Lub silicon wafer raug tshem tawm los ntawm ntab rau hauv dej hauv lub tshuab ntxhua khaub ncaws (rov qab sib cuag nrog cov kua qaub), cov ntsiab lus tseem ceeb ntawm cov kua qaub yog 24.5% HF, thiab cov tshuaj tiv thaiv tseem ceeb sib npaug suav nrog:

HF + SiO2 → SiF4 + H2O

SiF4+HF → H2SiF6

Nws yog tom qab ntawd ntxuav nrog dej thiab qhuav los ntawm rab riam cua ua ntej nkag mus rau cov txheej txheem tom ntej. Cov khoom siv ntawm BSG lub tshuab ntxhua khaub ncaws yog cov khoom siv ib nrab kaw, uas sib xyaw cov kua qaub thiab cov dej ntshiab huv lub tank, thiab tau nruab nrog cov txheej txheem tsim tawm los tsim lub micro-tsis zoo siab ib puag ncig hauv cov khoom siv los sau cov pa roj carbon monoxide.

Cov pa phem tseem ceeb hauv qhov txuas no suav nrog cov kua qaub tso pa (G4) uas muaj HF, uas tau sau los ntawm cov kav dej thiab xa mus rau cov kua qaub tso pa tawm rau kev kho mob. thiab cov dej khib nyiab muaj kuab heev uas muaj hydrofluoric acid (W10) thiab cov kua qaub ntxuav cov dej khib nyiab (W11).

 2) Rov qab etching

Txhawm rau txhim kho qhov kev xav ntawm sab nraum qab ntawm silicon wafer, sab nraum qab ntawm silicon wafer yog polished los ntawm alkali thiab polishing tus neeg saib xyuas.

Cov alkali polishing seem (6 kab) suav nrog kev ntxuav ua ntej-dej ntxuav-alkali polishing * 2-hydrogen peroxide tu (tso tseg)-micro-texturing (reserved)-ntshiab dej ntxuav-tom qab ntxuav-ntshiab dej ntxuav-pickling * 2 - ntxuav dej ntshiab tom qab pickling-qhib nqa, ua ntej lub cev qhuav dej-kom qhuav * 5 thiab lwm yam modules. Tag nrho cov txheej txheem ntawm kev rov qab etching yog ua tiav, kev siv lub caj npab conveyor xa cov khoom ua ntej ntxuav silicon wafer mus rau qhov chaw pub mis ntawm alkali ntuav tshuab, silicon wafer nyob rau hauv tsis siv neeg kaw alkali ntuav tshuab los ntawm cov menyuam los ntawm txhua. corrosion, ntxuav lub tank, cov cuab yeej tsis siv neeg tswj kom ntxiv cov kua qaub, lye thiab dej ntshiab hauv txhua qhov module, cov kua qaub thiab lye hauv lub tank tau tso rau hauv cov raj xa dej, thiab cov dej khib nyiab hauv lub tank tsis tu ncua.

 3) Kev ntxuav ua ntej

Tom qab ua tiav, silicon wafer nkag mus rau hauv lub tank tu kom tshem tawm cov khoom seem ntawm cov organic thiab ua kom huv si ntawm silicon wafer nto, yog li txhim kho cov kev hloov pauv ntawm tes mus rau qee yam. Lub loaded silicon wafer yog immersed nyob rau hauv pre-tu, dej ntshiab yog ntxiv rau lub tank, thiab ib tug tsim nyog tus nqi ntawm NaOH tov los yog tu tov (NaOH concentration yuav tsum yog 0.39%, H2O2 concentration yuav tsum yog 0.61%) yog ntxiv. Raws li qhov sib piv rau qhov kub thiab txias (60 ° C). Cov dej ntshiab huv tom qab ntxuav ua ntej. Kev ntxuav dej ntshiab yog tag nrho cov dej ntws los ntxuav, nqa tawm ntawm chav tsev kub rau 100s.

 4) Alkali pov tseg

Lub alkali pov lub tank yog nruab nrog cov dej ntshiab, thiab qhov tsim nyog ntawm NaOH tov thiab polishing additives yog ntxiv (li 1.6% ntawm NaOH tov, 0.97% ntawm polishing agent concentration), thiab tom qab ntawd sab nraub qaum ntawm silicon wafer yog polished ntawm kev khiav hauj lwm kub ntawm 65 ° C. Alkali ntuav yog ua raws li kev ntxuav dej huv. Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm pov tseg alkali yog raws li nram no:

Si+2NaOH+H2O=Na2SiO3+2H2↑

Qhov kub ua hauj lwm ntawm alkali pov lub tank yog 65 ° C, thiab lub sij hawm tswj alkali ntuav yog 220s.

 5) Tom qab ntxuav thiab micro-texturing

Cov dej ntshiab tau ntxiv rau lub tank, thiab qhov tsim nyog ntawm NaOH tov thiab hydrogen peroxide (kwv yees 0.55% ntawm NaOH tov, 0.25% ntawm hydrogen peroxide concentration) tau ntxiv raws li qhov sib npaug rau kev ntxuav chav sov. Tom qab ntxuav, ntxuav dej ntshiab yog nqa tawm.

 Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm micro-texturing txheej txheem yog raws li nram no:

Si+2NaOH+H2O=Na2SiO3+2H2↑

 6) Pickling

Tom qab ntxuav, dilute acid kua (0.9% HCl thiab 0.23% HF) yog yuav tsum tau rau high-purity tu, HCl lub luag hauj lwm ntawm neutralize cov seem ntawm NaOH, lub luag hauj lwm ntawm HF yog tshem tawm cov oxide txheej ntawm lub silicon. wafer ua rau saum npoo ntawm silicon wafer ntau hydrophobic, tsim ib txoj hauv kev ntawm silicon H2SiF6, los ntawm kev sib xyaw nrog cov hlau ions cais cov hlau ions ntawm qhov chaw ntawm silicon wafer, kom cov hlau ion ntsiab lus ntawm silicon wafer txo. , nyob rau hauv kev npaj rau diffusion thiab junction. Cov dej huv huv yog nqa tawm tom qab pickling.

 Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm pickling yog raws li nram no:

HCl + NaOH = NaCl + H2O

SiO2+6HF=H2SiF6+2H2O

 Kev ua haujlwm kub ntawm lub tank pickling yog qhov kub thiab txias, thiab lub sijhawm tswj lub sijhawm yog 100s.

 7) Ua kom qhuav

Lub qeeb-lifting pre-dehydrated crystalline silicon wafer raug xa mus rau lub tank kom qhuav, thiab silicon wafer tau tshuab los ntawm cua kub ntawm 90 ° C rau ziab, thiab ziab txais hluav taws xob cua sov.

Nyob rau hauv cov txheej txheem saum toj no rov qab etching, cov txheej txheem ua ntej ntxuav, alkali pov tseg thiab tom qab ntxuav cov txheej txheem yuav tsim cov dej khib nyiab siab uas muaj sodium hydroxide (W12, W14, W16) thiab cov alkaline tu dej khib nyiab (W13, W15, W17), thiab Cov txheej txheem pickling yuav tsim high-concentration acidic wastewater (W18) uas muaj hydrochloric acid thiab hydrofluoric acid thiab dav acidic tu dej khib nyiab (W19, W20). Kev ua haujlwm saum toj no yog ua nyob rau hauv lub kaw alkali blaster, thiab cov txheej txheem pickling yuav volatilize acid khib nyiab roj (G5) uas muaj HCl thiab HF, uas yog sau los ntawm lub raj xa dej thiab xa mus rau cov kua qaub pov tseg roj scrubber rau kev kho mob.

 POPAID deposition yog doped nyob rau hauv qhov chaw

Cov txheej txheem POPAID yog txheej txheem tseem ceeb rau txheej txheej txheej npaj los ntawm kev sib xyaw tunneling oxide txheej thiab doped crystalline silicon txheej.

Ua ntej, lub silicon wafer nkag mus rau hauv lub loading kab noj hniav nyob rau hauv lub atmospheric ib puag ncig, kis mus rau hauv ib tug 300 ° preheating chamber, thiab ces nkag mus rau hauv lub PO txheej txheem kab noj hniav, thaum lub sij hawm O2 yog thauj mus rau lub gas faib thaiv los ntawm lub trachea, thiab ionization yog qhib los ntawm. RF RF fais fab mov rau hauv ions, thiab cov ions oxidize rau saum npoo ntawm silicon wafer los tsim ib txheej tunneling oxide; Tom qab ntawd cov silicon wafer dhau los ntawm kev hloov pauv thiab tsis muaj kab noj hniav thiab raug thauj mus rau hauv cov kab noj hniav them nyiaj, thiab qhov chaw them nyiaj tso rau qee qhov tuab ntawm amorphous silicon nyob rau sab nraum qab ntawm lub substrate, thiab tib lub sijhawm, PH3 roj tau qhia thaum lub sij hawm tso nyiaj. txheej txheem, thiab gaseous phosphorane nkag mus rau hauv lub tshuab. Los ntawm 10kev thiab 0.5-2kev high-voltage xov tooj cua zaus kom excite phosphorus nyob rau hauv phosphorus mus rau hauv lub xeev ntawm phosphorus ions, ib tug DC high voltage yog ntxiv ntawm ion qhov chaw thiab hauv av, kom cov phosphorus ions tau lub zog los ntawm high- voltage hluav taws xob teb, qhov dav ntawm lub beam yog 420mm, thiab ces cov silicon wafer kis tau nyob rau hauv lub beam, thiab cov atoms ntawm lub them qhov chaw nqa P ions los yog reacts nrog P ions thaum lub sij hawm lub davhlau mus rau lub substrate kom tiav nyob rau hauv situ phosphorus doping. .

 Lub ntsiab lus sib npaug yog: PO + PAID = POPAID

 Plasma oxidation (PO): SiH4 + O2 → SiO2

Plasma-pab nyob rau hauv situ doping (PAID): Si (source) + PH3 → n-Si

Tom qab ua tiav cov tshuaj tiv thaiv, nws tau purged nrog nitrogen, thiab ion implantation tuaj nrog adsorbent, kev kho mob yuav ncav cuag 100%, phosphorane concentration ua ntej nkag mus rau hauv lub adsorption ntauwd yog 179.05ppm, thiab PH3 tsis kuaj tom qab adsorption. Qhov phiaj xwm no npaj siab txuas cov pa tso pa tawm mus rau DA003 tso pa roj ntauwd rau kev kho thiab tso dej, thiab lub tuam txhab npaj yuav teeb tsa lub tswb tsis siv neeg rau phosphorane leakage, nrog rau kev kuaj pom qhov txwv ntawm 0.1mg / m3.

Kev txheeb xyuas cov kev sib txuas ntawm cov pa phem: Cov kev sib txuas tseem ceeb ntawm cov txheej txheem no yog Ar, PH3 thiab N2 tau qhia thaum lub sijhawm ua haujlwm, uas tau sau los ntawm cov kav dej tshwj xeeb thiab xa mus rau cov kua qaub pov tseg roj scrubber rau kev kho mob.

 anneal

Lub silicon wafer yog muab tso rau hauv ib lub raj tshuaj tiv thaiv ua los ntawm quartz iav, thiab cov tshuaj tiv thaiv raj yog rhuab nrog ib tug tiv thaiv hlau cua sov rauv ntawm ib tug tej yam kub (qhov feem ntau siv kub yog 900 ~ 1200 ° C, uas yuav txo tau mus rau hauv qab 600 ° C. C nyob rau hauv cov xwm txheej tshwj xeeb), thiab thaum cov pa oxygen dhau los ntawm lub raj tshuaj tiv thaiv, cov tshuaj tiv thaiv tshuaj tshwm sim ntawm qhov chaw ntawm silicon wafer:

 Si (solid) + O2 (gaseous) → SiO2 (solid)

Kev faib tawm ntawm impurities tsim los ntawm cov txheej txheem annealing kuj tseem ua lub luag haujlwm hauv impurity absorption, thiab adsorption thiab fixation ntawm sodium thiab potassium ions los ntawm PSG yog siv los tshem tawm cov teeb meem ions.

Kev soj ntsuam ntawm kev tsim cov pa phem txuas: Lub ntsiab ntawm cov pa phem txuas ntawm cov txheej txheem no yog cov pa oxygen seem thiab nitrogen hauv cov pa kub kub.

 BOE ntxuav

BOE (5-kab) cov khoom siv trough yog ib qho khoom siv ib nrab kaw, thiab cov silicon wafer muab tso rau hauv lub pob tawb los ntawm cov khoom siv automation thiab hloov dua siab tshiab rau hauv txhua lub tank tov hauv cov khoom siv los ntawm cov neeg hlau caj npab. Ntawm lawv, lub tank tshuaj yog tas li replenished nrog cov tshuaj sib xws raws li qhov concentration ntawm cov tshuaj, thiab tag nrho yog hloov tsis tu ncua. Cov kua khib nyiab hloov pauv tau tawm mus rau hauv cov dej khib nyiab thiab thaum kawg mus rau hauv qhov chaw kho dej phwj tuaj kho. Cov dej ntxuav lub tank yog ntxuav nrog dej huv, thiab thaum muaj cov silicon wafers hauv lub dab dej, cov dej huv huv tau maj mam ntxiv, thiab cov dej qab ntsev cia li ntws mus rau cov dej khib nyiab, thiab thaum kawg nkag mus rau hauv qhov chaw kho dej phwj tuaj kho. Tag nrho cov tshuaj yog kua thiab tau txais kev tso tawm los ntawm cov twj diaphragm. Kev tu ib ntus yog: pickling tank * 2, dej ntxuav, tom qab pickling (HCL / HF / DI), dej ntxuav, qeeb nqa, ziab * 6, tank loj 720L.

 1) Pickling

Nws yog tsim nyog los siv dilute acid kua (3.15% HCl thiab 7.1% HF) rau high-purity tu, lub luag hauj lwm ntawm HCl yog siv Cl- complexed hlau ions, lub luag hauj lwm ntawm HF yog tshem tawm cov oxide txheej nyob rau saum npoo ntawm cov hlau. silicon wafer ua rau saum npoo ntawm silicon wafer ntau hydrophobic, tsim ib txoj hauv kev ntawm silicon H2SiF6, los ntawm kev sib xyaw nrog cov hlau ions cais cov hlau ions los ntawm qhov chaw ntawm silicon wafer, kom cov hlau ion ntsiab lus ntawm silicon wafer yog txo qis, HF pickling 150s tshem tawm BSG nyob rau hauv pem hauv ntej thiab PSG txheej nyob rau tom qab, Ntshiab dej ntxuav yog nqa tawm tom qab pickling.

HF + SiO2 → SiF4 + H2O

SiF4+HF → H2SiF6

 2) Pickling tom qab pickling

Tom qab kev ntxuav, nws yog ib qho tsim nyog yuav tsum tau siv cov kua qaub diluted (14.7% HF) rau kev ua kom huv huv, HF lub luag haujlwm yog tshem tawm cov oxide txheej ntawm qhov chaw ntawm silicon wafer los ua kom lub ntsej muag ntawm silicon wafer ntau dua. hydrophobic, tsim ib qho nyuaj ntawm silicon H2SiF6, thiab tshem tawm cov hlau ions los ntawm qhov chaw ntawm silicon wafer los ntawm cov complexation nrog hlau ions, kom cov hlau ion ntsiab lus ntawm silicon wafer txo.

Cov tshuaj tiv thaiv uas tshwm sim thaum lub sij hawm pickling yog raws li nram no: SiO2 + 6HF = H2SiF6 + 2H2O

 Kev ua haujlwm kub ntawm lub tank pickling yog qhov kub thiab txias, thiab lub sijhawm tswj lub sijhawm yog 100s.

 3) Tumble drying

Lub qeeb-lifting pre-dehydrated crystalline silicon wafer raug xa mus rau lub tank kom qhuav, thiab silicon wafer tau tshuab los ntawm cua kub ntawm 90 ° C rau ziab, thiab ziab txais hluav taws xob cua sov.

Cov txheej txheem pickling saum toj no yuav tsim cov dej khib nyiab siab uas muaj HCl, hydrofluoric acid (W21) thiab high-concentration acidic khib nyiab uas muaj hydrofluoric acid (W23), thiab cov kua qaub ntxuav cov dej khib nyiab (W22, 24, 25). Kev ua haujlwm saum toj no yog ua tiav hauv lub tshuab ntxuav, thiab cov txheej txheem pickling yuav volatilize kua qaub tso pa roj (G6) uas muaj HCl thiab HF thiab cov kua qaub pov tseg roj uas muaj HF (G7), uas tau sau los ntawm cov kav dej thiab xa mus rau cov kua qaub pov tseg roj scrubbers. rau kev kho mob.

ALD

ALD cov cuab yeej siv los pleev xim rau saum npoo ntawm silicon wafer nrog Al2O3 txheej los txhim kho cov nyhuv passivation thiab impurity absorption ntawm qhov chaw ntawm silicon wafer. Nws tsuas yog siv cov pa roj carbon monoxide Al (CH3) 3 los ua cov dej vapor (H2O) los ua Al (OH) 3, uas txuas rau saum npoo ntawm silicon wafers thiab tsim cov roj methane.

 Lub ntsiab lus sib npaug yog:

Al(CH3)3+3H2O→Al(OH)3+3CH4↑

2Al(OH)3→Al2O3+3H2O↑

Cov khoom siv ALD yog cov cuab yeej kaw tsis zoo, nruab nrog cua nkag, qhov hluav taws xob, qhov hluav taws xob thiab qhov hluav taws xob, cua sov yog hluav taws xob cua sov, cov khoom siv los nrog cov roj-dawb qhuav tshuab nqus tsev twj. Tom qab pib tsim khoom, tus neeg hlau caj npab thawj zaug pub cov hlwb rau hauv cov khoom siv ALD thiab kaw cov khoom qhib. Thaum tshav kub kub rau qee qhov kub, lub tshuab nqus tsev ua kom lub siab nyob hauv cov cuab yeej ua tau raws li qhov xav tau ntau lawm. Cov zaj duab xis tso AL2O3 yog tsim los ntawm alternating pulses ntawm cov roj-theem precursor TMA thiab H2O rau hauv cov tshuaj tiv thaiv chamber thiab tshuaj adsorbed ntawm deposition matrix. Thaum kawg, tom qab hloov cov pa roj methane hauv cov khoom siv los ntawm nitrogen, tig rau cov khoom siv thiab tshem tawm cov silicon wafer.

Cov pa phem tseem ceeb hauv qhov txuas no yog cov pa roj methane (G8), uas tau tso tawm los ntawm lub tshuab nqus tsev twj thiab kho los ntawm stainless hlau silane combustion lub tog raj kheej + dej tshuaj tsuag.

 Pem hauv ntej txheej

Lub hauv paus ntsiab lus tseem ceeb yog siv high-frequency photodischarge los tsim plasma los cuam tshuam cov txheej txheem ntawm cov yeeb yaj kiab tso tawm, txhawb kev decomposition, chemistry, excitation thiab ionization ntawm cov roj molecules, thiab txhawb kev tsim cov pab pawg reactive. Txij li thaum lub xub ntiag ntawm NH3 yog qhov tsim nyog rau kev khiav thiab kev nthuav tawm ntawm cov pab pawg nquag, qhov kev loj hlob ntawm cov yeeb yaj kiab tau zoo tuaj, thiab qhov kub ntawm qhov tso tawm tau txo qis heev.

Cov tshuaj tiv thaiv tseem ceeb uas tshwm sim thaum lub sij hawm tso tawm ntawm silicon oxide zaj duab xis los ntawm PECVD yog:

SiH4+NH3+N2O→xSi2O2N4+N2↑+yH2↑

PECVD cov cuab yeej siv yeeb yaj kiab zoo yog cov cuab yeej kaw tsis zoo, hluav taws xob cua sov, nrog cov roj tsis muaj cov tshuab nqus tsev vacuum. Thaum lub sij hawm tsim khoom, ua ntej sau cov khoom siv nrog nitrogen, tus neeg hlau caj npab ua tiav lub silicon wafer thauj khoom nkoj, tom qab lub siab sab nraud ntawm cov khoom siv mus txog qhov nkag, qhib qhov nkag thiab qhov hluav taws xob qhov chaw nres nkoj, lub nkoj graphite cia li nkag mus rau hauv cov khoom siv, thiab kaw lub inlet. thiab qhov hluav taws xob. Nqus thiab nqa tawm ntau yam kev soj ntsuam kev nyab xeeb, tom qab lees paub kev nyab xeeb, silane thiab ammonia tau qhia kom ua tiav cov txheej txheem silicon oxide hauv cov khoom siv. Tom qab txheej txheej tiav lawm, cov roj seem hauv cov kav dej tshwj xeeb thiab cov cuab yeej siv tau tawm los ntawm nitrogen, thiab tom qab ntawd lub qhov hluav taws xob thiab qhov hluav taws xob qhib thiab cov khoom raug tso tawm. Tom qab txias, nws nkag mus rau qhov kawg thiab nkag mus rau cov txheej txheem tom ntej.

Kev soj ntsuam ntawm cov pa phem kev sib txuas: Daim ntawv ua paug tseem ceeb ntawm cov txheej txheem tsim khoom yog txheej txheej pov tseg roj (silane, roj nkev ntau dhau, ntau dhau ammonia, hydrogen, nitrogen, thiab lwm yam) (G9), uas thawj zaug nkag mus rau hauv stainless hlau silane combustion cylinder los ntawm lub induced cua ntsawj ntshab system, thiab ces tawm nws tom qab kev kho mob los ntawm cov tshuaj tsuag ntauwd.

 Txheej hauv qab

Cov tshuaj tiv thaiv tseem ceeb uas tshwm sim thaum lub sij hawm tso tawm ntawm silicon oxide zaj duab xis los ntawm PECVD yog:

SiH4+NH3+N2O→xSi2O2N4+N2↑+yH2↑

PECVD thaub qab cov khoom siv yog kaw tsis zoo cov cuab yeej siv, hluav taws xob cua sov, nrog roj-dawb qhuav tshuab nqus tsev twj. Thaum lub sij hawm tsim khoom, ua ntej sau cov khoom siv nrog nitrogen, tus neeg hlau caj npab ua tiav lub silicon wafer thauj khoom nkoj, tom qab lub siab sab nraud ntawm cov khoom siv mus txog qhov nkag, qhib qhov nkag thiab qhov hluav taws xob qhov chaw nres nkoj, lub nkoj graphite cia li nkag mus rau hauv cov khoom siv, thiab kaw lub inlet. thiab qhov hluav taws xob. Nqus thiab nqa tawm ntau yam kev soj ntsuam kev nyab xeeb, tom qab lees paub kev nyab xeeb, silane thiab ammonia tau qhia kom ua tiav cov txheej txheem silicon oxide hauv cov khoom siv. Tom qab txheej txheej tiav lawm, cov roj seem hauv cov kav dej tshwj xeeb thiab cov cuab yeej siv tau tawm los ntawm nitrogen, thiab tom qab ntawd lub qhov hluav taws xob thiab qhov hluav taws xob qhib thiab cov khoom raug tso tawm. Tom qab txias, nws nkag mus rau qhov kawg thiab nkag mus rau cov txheej txheem tom ntej.

Kev soj ntsuam ntawm cov pa phem kev sib txuas: Daim ntawv ua paug tseem ceeb ntawm cov txheej txheem tsim khoom yog txheej txheej pov tseg roj (silane, roj nkev ntau dhau, ntau dhau ammonia, hydrogen, nitrogen, thiab lwm yam) (G9), uas thawj zaug nkag mus rau hauv stainless hlau silane combustion cylinder los ntawm lub induced cua ntsawj ntshab system, thiab ces tawm nws tom qab kev kho mob los ntawm cov tshuaj tsuag ntauwd.

 Metallization

 1) Kev luam ntawv

Thaum lub sij hawm luam ntawv, cov slurry yog saum toj no lub vijtsam, thiab lub scraper yog nias ntawm lub vijtsam phaj nrog lub siab, kom lub vijtsam deformation hu rau saum npoo ntawm silicon wafer. Lub slurry yog extruded los tiv thaiv qhov chaw ntawm silicon wafer; Qhov saum npoo adsorption quab yuam ntawm silicon wafer yog loj, thiab cov slurry yog snatched tawm ntawm lub mesh. Lub sijhawm no, lub scraper tau khiav, thiab lub phaj ua ntej deformed mesh yog nyob rau hauv qhov kev txiav txim ntawm lub zog rov qab zoo, kom cov slurry ntog du nto ntawm silicon wafer. Ntawm lawv, nyiaj paste yog muab tshuaj txhuam luam ntawv ua los ntawm ultra-fine thiab high-purity nyiaj thiab txhuas hmoov raws li cov hlau tseem ceeb, nrog rau qee yam ntawm cov organic binder thiab resin ua tus neeg sawv cev pabcuam.

Ua ntej ntawm tag nrho cov, rov qab electrode luam ntawv thiab ziab: kom raug qhov chaw luam tawm rov qab electrode paste (xws li laser xuas nrig ntaus txoj hauj lwm) (nyiaj muab tshuaj txhuam) nyob rau sab nraum qab ntawm lub roj teeb, thiab sai sai qhuav ntawm qhov kub thiab txias los xyuas kom meej tias cov luam ntawv rov qab electrode tsis puas. thaum luam ntawv hauv cov kauj ruam tom ntej.

Thib ob, sab nraub qaum zoo kab sib chaws luam ntawv, ziab: nyob rau sab nraum qab ntawm lub roj teeb kom raug qhov chaw luam ntawv zoo daim phiaj kab paste (nyiaj muab tshuaj txhuam), thiab qhuav sai sai ntawm qhov kub thiab txias, lub hom phiaj tseem ceeb yog hu rau silicon matrix, kis tam sim no, thiab rov dope, txo cov cab kuj recombination, nce boost.

Tom qab ntawd hla dhau lub flipper, thiab daim ntawv roj teeb tig los ntawm sab nraub qaum mus rau pem hauv ntej. Zoo electrode luam ntawv thiab ziab: Ua kom raug qhov zoo electrode muab tshuaj txhuam (nyiaj muab tshuaj txhuam) rau pem hauv ntej ntawm lub roj teeb, thiab qhuav sai sai ntawm qhov kub thiab txias, lub luag haujlwm tseem ceeb yog ua thiab xa cov tam sim no sau los ntawm cov kab sib chaws nyias mus rau sab nraud. circuit lossis nco.

Thaum kawg, sab pem hauv ntej zoo daim phiaj kab luam ntawv, ziab: nyob rau pem hauv ntej ntawm lub roj teeb kom raug qhov chaw muab tshuaj txhuam (nyiaj muab tshuaj txhuam) luam tawm pem hauv ntej electrode, tom qab luam ntawv, tos kom nkag mus rau sintering rauv khoom sintering, tsim ib tug zoo ohmic sib cuag, lub ntsiab muaj nuj nqi yog sau tam sim no, ua kom lub teeb haum lub peev xwm ntawm lub roj teeb daim ntawv, txhim kho cov conversion efficiency.

Qhov kub ntawm qhov ziab ntawm slurry hauv cov txheej txheem ziab saum toj no yog li 200 ° C. Cov txheej txheem no tsim cov pa roj carbon monoxide (G10), thiab cov pa phem tseem ceeb yog cawv ester kaum ob, ntsuas los ntawm VOCs. Cov roj khib nyiab organic tsim los ntawm cov txheej txheem luam ntawv yog sau los ntawm cov pa roj sau hood, adsorbed thiab kho los ntawm 2-theem tandem activated carbon adsorption box, thiab thaum kawg tawm los ntawm lub tog raj kheej tso tawm. Lub qhov tso pa tawm yuav tsum tau muab ntxuav thiab ntxuav tsis tu ncua kom nws txoj kev nqus tau zoo.

 2) Sintering

Sintering yog sinter lub ntsiab zoo daim phiaj muab luam tawm ntawm silicon wafer rau hauv cov ntawv roj teeb ntawm qhov kub thiab txias, kom cov electrode yog embedded nyob rau hauv qhov chaw los tsim ib tug ruaj khov mechanical kev sib cuag thiab ib tug zoo hluav taws xob kev twb kev txuas, thiab thaum kawg lub electrode thiab silicon. wafer nws tus kheej tsim ohmic sib cuag.

Cov ntawv luam tawm silicon wafer yog sintered siv lub sintering rauv (hluav taws xob cua sov), lub sintering rauv muab faib mus rau hauv ntau qhov chaw kub, silicon wafer ntaub ntawv sab sauv thiab sab electrodes thaum lub sij hawm sintering txheej txheem, thiab qhov siab tshaj plaws kub ntawm sintering yog 700 ~ 800 ° C. . Nyob rau hauv cov txheej txheem no, cov organic solvent cawv ester nyob rau hauv lub slurry yog kiag li volatilized rau cov organic pov tseg gas (G11), uas yog ntsuas los ntawm VOCs, thiab ces tag nrho hlawv los ntawm high-kub combustion ntauwd ntaus ntawv nrog cov khoom thiab ces adsorbed los ntawm ib tug. 2-theem series activated carbon adsorption box nrog cov luam ntawv pov tseg roj, thiab tawm los ntawm lub tog raj kheej tso tom qab adsorption.

 3) Hluav taws xob txhaj tshuaj

Tom qab lub cell yog sintered, cov txheej txheem ntawm kev txhaj tshuaj hluav taws xob ncaj qha ntawm cov neeg nqa khoom (rov qab txhaj tshuaj ncaj qha tam sim no) yog siv los hloov cov nqi ntawm hydrogen hauv lub cev silicon, thiaj li ua kom zoo passivate lub decaying boron-oxygen complex, hloov nws mus rau hauv. ib qho ruaj khov reecology, thiab thaum kawg ua tiav lub hom phiaj ntawm kev tiv thaiv kev yees duab.

 Kuaj lub ntim

Tom qab lub hnub ci cell yog tsim, cov hluav taws xob kev ua tau zoo ntawm lub hnub ci cell (xws li ntsuas nws IV nkhaus thiab lub teeb slew npaum li cas, thiab lwm yam) raug sim siv lub ntsuas ntsuas. Tom qab qhov kev xeem tiav lawm, lub roj teeb yuav raug muab faib ua ntau lub zog raws li qee cov qauv. Thaum tus naj npawb ntawm cov hlwb hauv ib lub iav ncav cuag tus lej teev, cov cuab yeej yuav ceeb toom tus neeg teb xov tooj kom tshem nws tawm thiab ntim nws. Cov cuab yeej tseem muaj cov khoom siv pov tseg, uas tsis lees paub cov khib nyiab thaum pom, es tsis yog kuaj nws li lub roj teeb ua tiav, cov txheej txheem uas tsim cov khib nyiab ntawm tes (S2).

【Disclaimer】 Lub hom phiaj ntawm kev tshaj tawm tsab xov xwm no yog txhawm rau nthuav tawm cov ntaub ntawv kev lag luam ntau ntxiv, rau kev siv nkaus xwb, thiab tsis tau txhais hais tias lub platform no yog lub luag haujlwm rau nws cov kev xav thiab cov ntsiab lus. Kev ua txhaum cai, thov hu rau Xiaobian kom tshem tawm, kev koom tes thiab cov lus nug, thov tso cov lus hauv keeb kwm yav dhau.